c o p y r igh t @ w i n s em i microelectronics c o . , lt d . , a l l ri g h t r e s er v ed . WFF2N65 WFF2N65 WFF2N65 WFF2N65 rev.a aug.2010 silicon silicon silicon silicon n-channel n-channel n-channel n-channel mosfet mosfet mosfet mosfet features ? 2a,650v(type),r ds(on) (max 5 ? )@v gs =10v ? ultra-low gate charge(typical 9.0nc) ? fast switching capability ? 100%avalanche tested ? isolation voltage(v iso =4000v ac) ? maximum junction temperature range(150 ) ? halogen free (WFF2N65-hf) general description this power mosfet is produced using winsemi's advanced planar stripe, v dmos technology. this latest technology has been especially designed to minimize on -state resistance,have a high rugged avalanche characteristics. this devices is specially well suited for high efficiency switch mode power supply . absolute maximum ratings symbol parameter value units v dss drain source voltage 650 v i d continuous drain current(@tc=25 ) 2* a continuous drain current(@tc=100 ) 1.3* a i dm drain current pulsed (note1) 16* a v gs gate to source voltage 30 v e as single pulsed avalanche energy (note2) 240 mj e ar repetitive avalanche energy (note1) 10 mj dv/dt peak diode recovery dv /dt (note3) 4.5 v/ ns p d total power dissipation(@tc=25 ) 23 w derating factor above 25 0.26 w/ t j ,t stg junction and storage temperature -55~150 t l maximum lead temperature for soldering purposes 300 * drain current limited by maximum junction temperature thermal characteristics symbol parameter value units min typ max r qjc thermal resistance , junction -to -case - - 5.4 /w r qcs thermal resistance , c ase-to-sink 0.5 - - /w r qja thermal resistance , junction-to -ambient - - 62 .5 /w
steady, steady, steady, steady, keep keep keep keep you you you you advance advance advance advance WFF2N65 WFF2N65 WFF2N65 WFF2N65 2 / 8 electrical characteristics(tc=25 ) characteristics symbol test condition min type max unit gate leakage current i gss v gs = 30 v,v ds =0v - - 100 na gate-source breakdown voltage v (br)gss i g = 10 a,v ds =0v 30 - - v drain cut -off current i dss v ds = 600 v,v gs =0v - - 10 a v ds =480v,tc=125 - 100 a drain -source breakdown voltage v (br)dss i d =250 a,v gs =0v 650 - - v break voltage temperature coefficient bv dss / t j i d =250 a,referenced to 25 0.65 - gate threshold voltage v gs(th) v ds =10v,i d =250 a 2 - 4 v drain -source on resistance r ds(on) v gs =10v,i d = 1 a - 4.2 5 ? forward transconductance gfs v ds = 50 v,i d = 1 a - 2.05 - s input capacitance c iss v ds =25v, v gs =0v, f=1mhz - 380 490 pf reverse transfer capacitance c rss - 7.6 9.9 output capacitance c oss - 35 49 switching time rise time tr v dd = 300 v, i d = 2 a r g = 25 ? (note4,5) - 15 42 ns turn-on time ton - 50 108 fall time tf - 40 89 turn-off time toff - 40 89 total gate charge(gate-source plus gate-drain) qg v dd = 320 v , v gs =10v, i d = 2 a (note 4 ,5) - 9.0 19 nc gate-source charge qgs - 1.7 - gate-drain("miller") charge qgd - 7.2 - source-drain ratings and characteristics(ta=25 ) characteristics symbol test condition min type max unit continuous drain reverse current i dr - - - 2 a pulse drain reverse current i drp - - - 6 a forward voltage(diode) v dsf i dr = 2 a,v gs =0v - - 1.4 v reverse recovery time trr i dr = 2 a,v gs =0v , di dr / dt =100 a / s - 200 - ns reverse recovery charge qrr - 1.3 - c note 1.repeativity rating :pulse width limited by junction temperature 2.l= 0.5m h i as = 2.0 a,v dd = 50 v, r g =0 ? ,starting t j =25 3.i sd 2.0 a,di/dt 200 a/us,v dd < bv dss ,starting t j =25 4.pulse test:pulse width 300us,duty cycle 2% 5. essentially independent of operating temperature. this transistor is an electrostatic sensitive device please handle with caution
steady, steady, steady, steady, keep keep keep keep you you you you advance advance advance advance WFF2N65 WFF2N65 WFF2N65 WFF2N65 3 / 8 fig.1 on-state cha ra cteristics fig.2 transfer current characteristics fig.3 on resistance variation vs drain current fig.4 body diode forward voltage variation vs source current and temperature fig.5 on-resistance variation vs junction temperature fig.6 gate charge characteristics
steady, steady, steady, steady, keep keep keep keep you you you you advance advance advance advance WFF2N65 WFF2N65 WFF2N65 WFF2N65 4 / 8 fig.7 maximum safe operation area fig.8 maximum drain current vs case temperature fig.9 transient thermal response curve
steady, steady, steady, steady, keep keep keep keep you you you you advance advance advance advance WFF2N65 WFF2N65 WFF2N65 WFF2N65 5 / 8 marking marking marking marking layout layout layout layout - : winsemi semiconductor logo ww : weekly code (01-52) yy : last two digit of calendar year (1 1 :201 1 ;1 2 :201 2 ) : hf halogen free null halogen ? : chip serial number ? ? ? ? h h h h WFF2N65 WFF2N65 WFF2N65 WFF2N65 ? ? ? ? wwyy wwyy wwyy wwyy
steady, steady, steady, steady, keep keep keep keep you you you you advance advance advance advance WFF2N65 WFF2N65 WFF2N65 WFF2N65 6 / 8 fig.10 gate test circuit & waveform fig.11 r esistive switching test circuit & waveform fig.12 uncamped inductive switching test circuit & waveform
steady, steady, steady, steady, keep keep keep keep you you you you advance advance advance advance WFF2N65 WFF2N65 WFF2N65 WFF2N65 7 / 8 fig.13 peak diode recovery dv/dt test circuit & waveform
steady, steady, steady, steady, keep keep keep keep you you you you advance advance advance advance WFF2N65 WFF2N65 WFF2N65 WFF2N65 8 / 8 to-220f to-220f to-220f to-220f package package package package dimension dimension dimension dimension unit:mm
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